Turnkey PCB Design • Hardware • Firmware • 3D

Eco-intelligent electronics engineered and shipped end-to-end.

Greentrace Studio partners with ambitious hardware teams for rapid schematics, dense PCB layout, firmware bring-up, reverse engineering, and enclosure modelling when documentation is thin. We stay onboard until your first article survives QA.

Explore Services View Case Samples Request a Quote
  • Rigid-flex wearable certified IP67 on first submission
  • 12-layer EV inverter controller validated for thermal swing
  • Legacy driver reverse engineered into RoHS-compliant BOM
Core service snapshots PCB • Firmware • IoT • 3D • Mechanical
High-density PCB close-up with gold pads
PCB Design HDI avionics board with blind/buried vias and RF tuning
Firmware engineer editing embedded code
Firmware Lab JTAG traces, automated regression rigs, OTA pipelines
IoT ecosystem illustration showing connected devices
IoT Systems Edge telemetry, secure provisioning, cloud handoff tested
Rendered gears highlighting 3D modelling fidelity
3D Printing Rapid enclosure sprints with thermal venting and CMF polish
Mechanical assembly render with stacked gears
Mechanical Integration Assembly validation, tolerance reviews, and field-ready rigs

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Custom PCB layouts delivered

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Average concept-to-layout handoff

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QA aligned documentation

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RF, thermal, environmental validation

Teams we accelerate

MedTech wearables Industrial automation Defense research Green energy IoT Creative installations Robotics platforms

Greentrace Studio adapts compliance, sustainability goals, and documentation rigor to match each industry vertical.

Capabilities

End-to-end PCB & product design services.

Work with a single team that can capture requirements, implement hardware, model enclosures, and prepare production-ready packages.

PCB Design & Simulation

High-speed, RF, rigid-flex, and dense multilayer layout using Altium and KiCad with full DFM checks.

Custom Hardware Engineering

System architecture, component selection, power budgeting, bring-up, and validation documentation.

Firmware & Embedded Software

Bare-metal and RTOS development for STM32, ESP32, Nordic, Microchip, and custom bootloaders.

3D Modeling & Enclosure Design

Mechanical integration, thermal simulation, and 3D printable models that align with PCB keep-outs.

Reverse Engineering

Legacy board recreation, documentation rebuilds, and BOM modernization for unsupported hardware.

Manufacturing Support

Gerber, ODB++, assembly drawings, test fixtures, and vendor coordination until first article approval.

Why teams choose us

Every sprint ships with clarity, instrumentation, and traceability.

We combine collaborative reporting with lab-grade validation so you know exactly how your hardware behaves before production.

Instrumented labs

6 GHz VNA, multi-channel thermal imaging, and automated load banks capture evidence for every design decision.

  • EMI / EMC pre-checks
  • Thermal stress logs
  • Vibration fixtures

Weekly design drops

Time-stamped PDFs, Gerber snapshots, and firmware diffs land in your inbox with action items and blockers.

  • Shared Kanban
  • Video walkthroughs
  • Traceable reviews

Secure collaboration

Encrypted vaults for NDAs, segregated build servers, and redacted doc sets for vendors keep IP safe.

  • NDA-first intake
  • Secure file portal
  • On-call support

Workflow

Transparent process with weekly design drops.

  1. Discovery & Specification

    We translate requirements into an actionable specification with schedules, deliverables, and budgets.

  2. Schematic & Layout

    Iterative design reviews plus simulation snapshots keep stakeholders aligned.

  3. Firmware & Prototype

    Firmware sprints, bring-up logs, and validation testing ensure every board boots flawlessly.

  4. Production Handoff

    Manufacturing files, test plans, and on-call support until the first batch passes QA.

Industries Served

Specialized experience for demanding environments.

We adapt compliance, BOM, and thermal strategies per industry, from harsh industrial automation to wearable consumer tech.

Lab snapshots

Instrumentation tuned for rapid debug.

Signal integrity benches, accelerated life testing rigs, and firmware pods stay hot so your sprint never waits on lab time.

Signal Integrity Pod

6 GHz VNA, TDR probes, and automated eye-diagram capture keep high-speed channels honest.

Includes fixture fabrication + SI reporting.

Reliability Bay

Thermal shock, humidity, and 3 m drop rigs accelerate field failures before customers ever see them.

Live dashboards share pass/fail evidence.

Embedded Studio

Dedicated bring-up bench with logic analysis, RF sniffing, and automated regression harnesses.

Perfect for OTA, BLE, and IoT stacks.

Featured Samples

Highlighting cross-discipline hardware builds.

Dense PCB routing

Industrial-grade PCB design

HDI routing, impedance control, stack-up modelling, and automated DFM with Gerber snapshots.

PCB • DFM
Engineer debugging firmware

Firmware validation rig

Driver bring-up, secure boot, regression benches, and OTA orchestration with live telemetry.

Firmware • Automation
PCB simulation plots

Simulation-first PCB assurance

Stack-up solvers, signal-integrity eye analysis, power-integrity droop checks, and electro-thermal sweeps feed executive-ready validation dossiers.

PCB • Simulation
Symbol library illustration

Symbol automation

Authoritative libraries with IPC-compliant naming, metadata, and real-time sync into Altium/KiCad.

Symbols • Governance
Footprint detail view

Footprint authoring

IPC-7351 footprints, 3D step alignment, assembly notes, and rotation metadata for CM import.

Footprints • QA
Wearable biosensor flex PCB

Wearable biosensor stack

Flex-rigid PCB, BLE telemetry, low-noise analog front-end, and body-safe coatings.

PCB • Firmware
Industrial IoT deployment

Industrial IoT controller

Quad-core MCU, isolated IO, reverse-engineered fieldbus, and hardened OTA stack.

IoT • Reverse engineering
Rendered gear-driven enclosure concept

Custom 3D printing solutions

Snap-fit housings, integrated heat pipes, printable prototypes, and CMF-ready documentation.

3D models • Thermal
Reverse engineering bench

Reverse engineering lab

Netlist recreation, protocol sniffing, BOM modernization, and re-spin ready schematics.

Reverse • Sustaining

Need a quote?

Tell us about your next PCB or hardware sprint.

We reply with milestones, sustainability levers, and transparent pricing within one business day. Attach NDAs or BOM snapshots right inside the popup uploader.

Attach design packs Schematics, BOMs, NDAs